Cover of Diffusion Soldering for the High-temperature Packaging of Power Electronics

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Diffusion Soldering for the High-temperature Packaging of Power Electronics

Aarief Syed-Khaja · 2019

Prozessoptimierung Hochtemperatur Diffusionslöten Intermetallische Verbindungen Verbindungstechnik Leistungselektronik

Open source ↗ DOAB

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Public-domain status shown for GLOBAL. DOAB open-access record with explicit license: open access